Life-cycle Assessment of LSI Packaging Embossed Tape Made from Bio-based Polymer

Abstract

This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer