An Integrated Silicon Nanowire Field Emission Electron Source on a Chip with High Electron Transmission

P. Buchner, M. Hausladen, A. Schels, F. Herdl, S. Edler, M. Bachmann, R. Schreiner
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Abstract

Silicon nanowire field emission arrays (50 × 50 pillars) were fabricated on a silicon glass hybrid wafer. The glass acts both as the support for the whole structure and insulator between cathode and extraction grid. The extraction grid matches the emitter structures and is optically aligned and adhered to the emitter chip by a vacuum compatible epoxide adhesive. These chips exhibit an emission current of about 600 $\mu{\mathrm{A}}$ at an extraction voltage of 300 V. The electron transmission through the grid is above 80 %. 58-hour longtime measurements were conducted showing low degradation of the emission current and high stability of electron transmission.
高电子透射率芯片上集成硅纳米线场发射电子源
在硅玻璃杂化晶圆上制备了50 × 50柱的硅纳米线场发射阵列。玻璃既作为整个结构的支撑,又作为阴极和提取栅极之间的绝缘体。提取网格匹配发射器结构,并通过真空兼容环氧化物粘合剂光学对准并粘附到发射器芯片上。这些芯片在提取电压为300 V时的发射电流约为600 $\mu{\ mathm {A}}$。电子通过栅极的透射率在80%以上。经过58小时的长时间测量,表明发射电流衰减小,电子传输稳定性高。
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