Single-Sweep vs. Banded Characterizations of a D-band Ultra-Low-Loss SiC Substrate-Integrated Waveguide

Lei Li, S. Reyes, M. J. Asadi, D. Jena, H. Xing, P. Fay, J. Hwang
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Abstract

A D-band (110-170GHz)SiC substrate-integrated waveguide (SIW) is characterized on-wafer by two different vector network analyzers (VNAs): a 220-GHz single-sweep VNA and an 110-GHz VNA with WR8 (90-140GHz) and WR5 (140-220GHz) frequency extenders. To facilitate probing, the SIW input and output are transitioned to grounded coplanar waveguides (GCPWs). Two-tier calibration is used to de-embed the SIW-GCPW transitions as well as to extract the intrinsic SIW characteristics. In general, the two VNAs are in agreement and both result in an ultra-low insertion loss of approximately 0.2 dB/mm for the same SIW, despite stitching errors at band edges.
d波段超低损耗SiC衬底集成波导的单扫与带特性研究
d波段(110-170GHz)SiC基板集成波导(SIW)通过两种不同的矢量网络分析仪(VNA)在晶圆上进行表征:220 ghz单扫描VNA和110 ghz带WR8 (90-140GHz)和WR5 (140-220GHz)频率扩展器的VNA。为了便于探测,SIW输入和输出被转换为接地的共面波导(gcpw)。采用两层定标法对SIW- gcpw转换进行去嵌入,提取SIW的固有特征。总的来说,这两种vna是一致的,尽管在带边缘有拼接误差,但对于相同的SIW,两者都可以产生约0.2 dB/mm的超低插入损耗。
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