H. Shi, F. Yuan, F. Sha, J. Drewniak, T. Hubing, T. van Doren
{"title":"Simulation and measurement for decoupling on multilayer PCB DC power buses","authors":"H. Shi, F. Yuan, F. Sha, J. Drewniak, T. Hubing, T. van Doren","doi":"10.1109/ISEMC.1996.561273","DOIUrl":null,"url":null,"abstract":"DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model at low frequencies (<200 MHz), and a mixed-potential integral equation approach at high frequencies. In order to determine the lumped parameters of via interconnects, an effective procedure using a network analyzer has been developed to characterize the trace/via inductances/resistances. For an 8\"/spl times/10\" ten-layer test board used in this study, the simulations show good agreement with the measurement. This method can lead to new design strategies of decoupling for multilayer PCB power buses.","PeriodicalId":296175,"journal":{"name":"Proceedings of Symposium on Electromagnetic Compatibility","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1996.561273","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model at low frequencies (<200 MHz), and a mixed-potential integral equation approach at high frequencies. In order to determine the lumped parameters of via interconnects, an effective procedure using a network analyzer has been developed to characterize the trace/via inductances/resistances. For an 8"/spl times/10" ten-layer test board used in this study, the simulations show good agreement with the measurement. This method can lead to new design strategies of decoupling for multilayer PCB power buses.