A. Agarwal, R. Siergiej, S. Seshadri, M. White, P. McMullin, A. Burk, L. Rowland, C. Brandt, R. Hopkins
{"title":"A critical look at the performance advantages and limitations of 4H-SiC power UMOSFET structures","authors":"A. Agarwal, R. Siergiej, S. Seshadri, M. White, P. McMullin, A. Burk, L. Rowland, C. Brandt, R. Hopkins","doi":"10.1109/ISPSD.1996.509462","DOIUrl":null,"url":null,"abstract":"A realistic performance projection of 4H-SiC UMOSFET structures based on electric field in the gate insulator consistent with long-term reliability of insulator is provided for the breakdown voltage in the range of 600 to 1500 V. The use of P/sup +/ polysilicon gate leads to higher breakdown voltage as the Fowler Nordheim injection from the gate electrode is reduced. It is concluded that the insulator reliability is the limiting factor and therefore the high temperature operation of these devices may not be practical.","PeriodicalId":377997,"journal":{"name":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"24","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1996.509462","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 24
Abstract
A realistic performance projection of 4H-SiC UMOSFET structures based on electric field in the gate insulator consistent with long-term reliability of insulator is provided for the breakdown voltage in the range of 600 to 1500 V. The use of P/sup +/ polysilicon gate leads to higher breakdown voltage as the Fowler Nordheim injection from the gate electrode is reduced. It is concluded that the insulator reliability is the limiting factor and therefore the high temperature operation of these devices may not be practical.