Trends in cooling technology for high-density packaging

Abstract

A general look at the development of cooling systems for multichip modules over the last few years reveals a clear increase in the levels of power dissipation. Heat transfer and cooling methods for multichip modules are considered. The extremely high demands placed on cooling systems are leading to increasingly cost-intensive technical solutions. Microcooling systems must be capable of integration in order to cool the 3D computer structures of the future. A microcooler produced in Si etched technology is presented as the foundation of this type of cooling system.<>