Comparison of transient thermal parameters for different die connecting approaches

Abstract

This paper compares two die connecting approaches based on a simple experimental method, which can achieve accurate characterizations of transient and steady state die thermal parameters. This method, named thermal resistance analysis by an induced transient (TRAIT) method, uses the first n terms of the time-constant spectrum obtained from the cool-down temperature transient measurements to get the complete characterizations of a Cauer equivalent thermal network with n cells. The details of this method including the experimental setup, cool-down temperature recording, curve fitting of the temperature curve, and impedance decomposition are introduced. An improved TRAIT method is introduced. The Cauer equivalent thermal circuit of the embedded power die connecting approach using this method is obtained and compared to the equivalent circuit of wire-bond die connecting approach as a benchmark.