P. Evans, M. Ziari, V. Lal, S. Corzine, T. Butrie, M. Missey, D. Pavinski, J. Tang, J. Summers, P. Studenkov, A. Hosseini, T. Vallaitas, M. Kuntz, W. Ko, F. Sedgwick, M. Fisher, H. Sai, J. Zhang, P. Samra, J. Pleumeekers, J. Rahn, V. Dominic, P. Schindler, R. Schmogrow, S. Kumar, P. Mertz, K. Croussore, H. Sun, K. Wu, M. Mitchell, M. Reffle, F. Kish, D. Welch
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引用次数: 0
Abstract
We present data for long-haul, metro, and data-center applications using large scale Photonic Integrated Circuits (PICs) packaged in high capacity optical modules.
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