Modelling of temperature and dispersion effects in MESFET and HEMT transistors

M. Chaibi, T. Fernandez, J. R. Tellez, A. Tazón, M. Aghoutane
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引用次数: 2

Abstract

In this paper, an accurate technique to model temperature, bias, and frequency dispersion effects in MESFET and HEMT transistors is presented. The approach is based on a single drain to source current source I ds nonlinear model. Pulsed I/V characteristics measurements are used to model bias and frequency dispersion effects while temperature is directly implemented in the I ds equation. Model parameters extraction strategy is simple, being based just on a few measurements. The approach validity is verified by comparing the simulated and measured I/V characteristics of the device tested under continuous and pulsed excitation. Large-signal simulation results show that the model can efficiently predict the output power under different bias and temperature conditions.
MESFET和HEMT晶体管中温度和色散效应的建模
本文提出了一种精确模拟MESFET和HEMT晶体管中温度、偏置和频散效应的技术。该方法是基于单漏源电流源I - ds非线性模型。脉冲I/V特性测量用于模拟偏置和频率色散效应,而温度直接在I - ds方程中实现。模型参数提取策略简单,仅基于少量测量值。通过比较连续激励和脉冲激励下器件的模拟和实测I/V特性,验证了该方法的有效性。大信号仿真结果表明,该模型能有效预测不同偏置和温度条件下的输出功率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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