Potential packaging solutions for integrated single-chip transceivers above 100 GHz

Abstract

This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.