Effect of Light Curing Modes of High-Powered LEDs on Temperature Rise under Primary Teeth Dentin (An In Vitro Study)

Obada Jabbour
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引用次数: 1

Abstract

Background: Temperature rise in the pulp chamber is a severe stress that can cause irreversible damage to the pulp. This study aimed to evaluate the effect of three curing modes of a high-powered LED and two remining dentin thicknesses on the temperature rise under primary teeth dentin. Methods: One dentin disc of 1 mm thickness were prepared from human primary molar. The dentin disc was exposed to curing light using a high-powered LED for 10 s to simulate bonding agent polymerization (stage 1 curing). Five specimens of resin composite were cured for 20 s. The different modes tested were standard, ramp, and pulse mode (n=5). After that the dentin disc was grinded to 0.5 mm thick and the experiments were repeated. Temperature change data were subjected to analysis of variance (ANOVA) and Tukey's test. Results: The highest temperature rise was observed under the 0.5-mm-thick dentin disc with standard mode (7.6±0.234; 4.78±0.4207), whereas the lowest values were recorded with pulse mode under 1-mm-thick dentin (4.8±0.458; 3.16±0.829) during stage 1 curing and resin composite polymerization, respectively. Pulse mode produced a significantly lower values compared to standard mode in all conditions (P<0.05). An inverse proportion was found between the mean temperature rise values and the dentin thickness. Conclusions: High-powered LEDs should not be used to cure bonding agents in deep cavities. The maximum temperature rise induced by a high-powered LED during resin composite polymerization was not critical for pulpal health. Temperature rise related to dentin thickness and curing modes.
大功率led光固化方式对乳牙牙本质下温升的影响(体外研究)
背景:牙髓腔内的温度升高是一种严重的应力,会对牙髓造成不可逆的损害。本研究旨在评估三种高功率LED固化模式和两种牙本质厚度对乳牙牙本质下温升的影响。方法:以人第一磨牙为材料制备厚度为1mm的牙本质盘1块。将牙本质盘暴露在高功率LED固化光下10 s,模拟粘结剂聚合(阶段1固化)。5个树脂复合材料试件固化20 s。测试的不同模式为标准模式、斜坡模式和脉冲模式(n=5)。将牙本质盘磨至0.5 mm厚,重复实验。温度变化数据采用方差分析(ANOVA)和Tukey检验。结果:0.5 mm厚牙本质盘标准模式下温升最高(7.6±0.234;(4.78±0.4207),而在1 mm厚牙本质处脉冲模式记录的值最低(4.8±0.458;第1阶段固化和树脂复合聚合时,分别为3.16±0.829)。在所有条件下,脉冲模式产生的数值均显著低于标准模式(P<0.05)。平均温升值与牙本质厚度成反比。结论:大功率led不宜用于深腔粘接剂固化。在树脂复合聚合过程中,大功率LED引起的最高温升对牙髓健康并不是至关重要的。温升与牙本质厚度和固化方式有关。
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