HEATSMART: An interactive application aware thermal management framework for MPSoC embedded systems

Jude Angelo Ambrose
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引用次数: 3

Abstract

Multiprocessor System-on-Chip (MPSoC) is emerging as an integral component in embedded systems, such as mobile phones, PDAs, handheld medical devices, etc. Due to its immense processing power and incumbent hardware resources the users are able to execute multiple concurrent applications. The more applications the MPSoC executes the more heat it dissipates. Such eminent heat dissipation damages the device and induces faults, causing a shorter life span. Thus, thermal aware designs are of utmost important for durable and dependable embedded devices. The MPSoC could potentially control and manage the heat dissipation using techniques such as computation migration. However, this would be based on the operational behavior of the hardware, but not on the behavior of the applications mapped and executed on the hardware. We propose an interactive temperature management where the users are allowed to provide inputs to effectively manage the heat dissipation and at the same time are able to operate the applications according to their will. We propose and demonstrate a formal design methodology to assist the people involved during the design process.
HEATSMART:用于MPSoC嵌入式系统的交互式应用感知热管理框架
多处理器片上系统(MPSoC)正在成为嵌入式系统(如移动电话、pda、手持医疗设备等)中不可或缺的组成部分。由于其强大的处理能力和现有的硬件资源,用户能够执行多个并发应用程序。MPSoC执行的应用程序越多,它散发的热量就越多。这种严重的散热会损坏设备,引起故障,缩短设备的使用寿命。因此,热感知设计对于耐用和可靠的嵌入式设备至关重要。MPSoC可以通过计算迁移等技术来控制和管理散热。但是,这将基于硬件的操作行为,而不是基于在硬件上映射和执行的应用程序的行为。我们提出了一种交互式温度管理,允许用户提供有效管理散热的输入,同时能够根据自己的意愿操作应用程序。我们提出并演示了一种正式的设计方法,以帮助参与设计过程的人员。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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