Thin film VCSEL assembly on CMOS IC using ELO and nano paste metallization

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338680

T.-Y. Kondo, S. Kitamura, Y. Nimura, T. Kaneko, T. Shimoda

引用次数: 2

Abstract

In this work, we present the enhancement of previous work by monolithically appearance assembly using nano paste metallization on IC with Au plated pads and higher frequency operation. We have demonstrated the assembly of thin film VCSEL on CMOS laser driver IC in monolithically dimension. ELO (epitaxial liftoff) technique, polyimide bonding and nano paste metallization with Au plated pads were used for this work. The modulation of light output from thin film VCSEL at 2.5 Gbps was achieved.

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利用ELO和纳米膏状金属化技术在CMOS集成电路上组装薄膜VCSEL

在这项工作中，我们提出了在集成电路上使用纳米糊金属化镀金焊盘和更高频率操作的单片外观组装的改进。我们展示了薄膜VCSEL在单片尺寸CMOS激光驱动IC上的组装。采用ELO(外延提升)技术、聚酰亚胺键合技术和镀金焊盘纳米膏状金属化技术。实现了薄膜VCSEL光输出速率为2.5 Gbps的调制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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