Next generation functional test program development system

D. Rolince, D. Giles
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引用次数: 3

Abstract

While superior-quality functional board test has been a goal for most high reliability electronics manufacturers, the time and effort for generating such test programs using today's tools and processes makes this difficult to achieve in a cost effective manner. This paper will introduce a revolutionary approach to functional board test program development that combines the comprehensiveness of software-based simulation with the speed and simplicity of hardware emulation. The result is a functional Test Program Set development system that can produce high fault coverage, diagnostic test programs in a fraction of the time it takes using traditional techniques, and at a lower unit cost. In this paper we will first provide a brief background on the strengths and weaknesses of current software and hardware TPS development techniques-simulation hot mock-up. Next, the new approach is described in detail and contrasted against the existing techniques. Finally, we present actual experience to date using a prototyped system.
下一代功能测试程序开发系统
虽然高质量的功能板测试一直是大多数高可靠性电子制造商的目标,但使用当今的工具和工艺生成此类测试程序的时间和精力使得难以以经济有效的方式实现这一目标。本文将介绍一种革命性的功能板测试程序开发方法,该方法将基于软件的仿真的全面性与硬件仿真的速度和简单性相结合。结果是一个功能测试程序集开发系统,它可以在使用传统技术所需的一小部分时间内产生高故障覆盖率和诊断测试程序,并且单位成本较低。在本文中,我们将首先简要介绍当前软硬件TPS开发技术——仿真热模型的优缺点。其次,详细描述了新方法,并与现有技术进行了对比。最后,我们介绍了迄今为止使用原型系统的实际经验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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