Analysis Models for Case Design Above 1 GHz

L. Campbell, D. G. Williams
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引用次数: 1

Abstract

This paper describes an analysis method used to provide enclosure (case) design guidance applicable at frequencies above 1 GHz. The models developed herein establish design constraints for EMI gaskets, fastener spacing, cover to case flatness, and case thickness. Additionally, this paper shows the usefulness of the models for evaluating existing design discrepancies uncovered bv tests. Summary This analysis approach, including models, and their application technique, was developed when a need was determined by a 200V/M R.F. Susceptibility requirement up to 40 GHz. Hardware was being designed and no method to determine a higher design confidence was available. This analysis was used to provide early design analysis of equipment enclosures for compliance with the 200V/M requirement above 1 GHz. The shielding effectiveness of cases was evaluated for leakage.
1ghz以上机箱设计分析模型
本文描述了一种分析方法,用于提供适用于1ghz以上频率的外壳(外壳)设计指导。本文开发的模型建立了电磁干扰垫圈、紧固件间距、盖板与外壳平面度和外壳厚度的设计约束。此外,本文还展示了模型对于评估由测试发现的现有设计差异的有用性。这种分析方法,包括模型及其应用技术,是在需求由200V/M的射频敏感性需求确定到40ghz时开发的。当时正在设计硬件,没有办法确定更高的设计置信度。该分析用于提供符合1ghz以上200V/M要求的设备外壳的早期设计分析。评估了壳体对泄漏的屏蔽效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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