Mitigation of mutual coupling in microstrip antenna arrays

K. P. Rao, R. Vani, P. Hunagund
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Abstract

This article demonstrates the alleviation of mutual coupling of a simple and low-cost four-element microstrip array antenna by loading I-shaped slot-type electromagnetic band gap structure in the ground plane. FR-4 glass epoxy is used as dielectric substrate. Moreover, the proposed array antenna shows a better performance in terms of multi-band resonance. The antenna is resonating at four frequencies and a virtual size reduction of 78.48% is obtained. The designed array antenna possesses directional radiation properties. Mentor Graphics IE3D software is used to design and simulate the designed antennas and the measured results are obtained using vector network analyser.
微带天线阵列中相互耦合的缓解
本文通过在地平面上加载i型槽型电磁带隙结构来缓解简单、低成本的四元微带阵列天线的相互耦合。采用FR-4玻璃环氧树脂作为介电基材。此外,该阵列天线在多波段谐振方面表现出更好的性能。该天线在四个频率下谐振,实际尺寸减小78.48%。所设计的阵列天线具有定向辐射特性。利用Mentor Graphics IE3D软件对所设计的天线进行了设计和仿真,并利用矢量网络分析仪获得了测量结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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