Experimental Investigations on Thermal Performance of PCM Based Heat Sink for Passive Cooling of Electronic Components

ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels Pub Date : 2018-06-10 DOI:10.1115/ICNMM2018-7732

R. Kothari, Pawan Mahalkar, S. Sahu, S. I. Kundalwal

{"title":"Experimental Investigations on Thermal Performance of PCM Based Heat Sink for Passive Cooling of Electronic Components","authors":"R. Kothari, Pawan Mahalkar, S. Sahu, S. I. Kundalwal","doi":"10.1115/ICNMM2018-7732","DOIUrl":null,"url":null,"abstract":"In the present experimental study, an attempt has been made to study the efficient thermal management system based on phase change material for cooling of portable electronic devices. Paraffin wax is used as PCM to keep the temperature of electronic devices below critical temperature by absorbing thermal energy released by electronic components. PCM is filled inside the heat sink made of aluminum. Four different configuration of heat sink such as unfinned heat sink filled with pure PCM, two finned heat sink filled with pure PCM, unfinned heat sink filled with MF-PCM composite and two finned heat sink filled with MF-PCM composite are used in the present investigation to enhance the operating time of heat sink to reach critical set point temperature. Unfinned heat sink filled with and without PCM is used for baseline comparison. Effect of volume fraction of PCM, effect of heat flux and enhancement in operating time are reported in this study. Enhancement ratios are obtained for various heat sink configurations. The comparison of thermal performance of different configuration shows that higher enhancement ratio and effective thermal control is obtained with two finned metal foam heat sink.","PeriodicalId":137208,"journal":{"name":"ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/ICNMM2018-7732","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 15

Abstract

In the present experimental study, an attempt has been made to study the efficient thermal management system based on phase change material for cooling of portable electronic devices. Paraffin wax is used as PCM to keep the temperature of electronic devices below critical temperature by absorbing thermal energy released by electronic components. PCM is filled inside the heat sink made of aluminum. Four different configuration of heat sink such as unfinned heat sink filled with pure PCM, two finned heat sink filled with pure PCM, unfinned heat sink filled with MF-PCM composite and two finned heat sink filled with MF-PCM composite are used in the present investigation to enhance the operating time of heat sink to reach critical set point temperature. Unfinned heat sink filled with and without PCM is used for baseline comparison. Effect of volume fraction of PCM, effect of heat flux and enhancement in operating time are reported in this study. Enhancement ratios are obtained for various heat sink configurations. The comparison of thermal performance of different configuration shows that higher enhancement ratio and effective thermal control is obtained with two finned metal foam heat sink.

查看原文本刊更多论文

基于PCM的电子元件被动冷却散热器热性能实验研究

在本实验研究中，尝试研究了一种基于相变材料的高效热管理系统，用于便携式电子设备的冷却。石蜡作为PCM，通过吸收电子元件释放的热能，使电子器件的温度保持在临界温度以下。PCM填充在铝制的散热器内。采用纯PCM填充的无翅片散热器、纯PCM填充的双翅片散热器、MF-PCM复合材料填充的无翅片散热器和MF-PCM复合材料填充的双翅片散热器四种不同的散热器结构，以延长散热器达到临界设定值温度的工作时间。无翅片散热器填充和不填充PCM用于基线比较。本文报道了PCM体积分数的影响、热流密度的影响以及操作时间的增强。得到了不同散热片结构的增强比。不同结构的热性能比较表明，两种翅片金属泡沫散热器具有较高的强化率和有效的热控制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels

自引率

0.00%

发文量