Advanced chip-in-board thin film hybrid technology with integrated polyimide film capacitors for ultra high-speed and millimeter-wave applications

Abstract

The processing of extreme high bit rates (/spl ges/20 Gbit/s) or signal frequencies (/spl ges/20 GHz) is of increasing importance for advanced telecommunications. Therefore a suitable circuit arrangement is necessary. Problems like frequency dispersion of microstrip lines, frequency dependence of parasitic impedances, and transforming characteristics of any finite length of layer must be solved. For this purpose a chip-in-board embedding technique with integrated film capacitors was developed. The article describes the manufacturing of such thin film hybrid circuits containing planar capacitors and feed-through capacitors. The chip interconnection technology is represented too.