Methodology for analysis of defects in electronic assembly using Xray

Abstract

The report presents a methodology for defect analysis using Xray, which enables quality assurance in electronic assemblies. The main defects examined relate to the formation of the soldering joint and its properties in the volume, as well as the optically hidden defects of assembling. We present the main types of analyses that Xray allows - Voids, BGA, Fill in, pictures of hidden defects, and examples of real strength evaluation of soldering joints. The relationship between the results of the Xray control and the strength of the soldering was investigated.