Evaluation of packages by simulating IC emission using a LECCS model

Abstract

We applied a LECCS (linear equivalent circuit and current source) model that has been proposed as a model for EMI simulation of an LSI to evaluate package EMI characteristics. We divided the LSI into the chip part and the package part and described it using the LECCS model. We simulated the power supply current spectrum while changing the package part. The measurement results, obtained using the MP (magnetic probe) method, were compared with the simulation results. Our results confirmed that the LECCS model is valid for impact evaluation of the EMI characteristics of a package