Study on Glass-metal Bonding by Anodic Bonding.

Transactions of the Japan Welding Society Pub Date : 1993-10-01 DOI:10.2207/QJJWS.11.208

M. Toyoda, Y. Fujiya, M. Nayama, Tadashi Yamada

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引用次数: 5

Abstract

Anodic bonding of glass and Si, which is performed by applying positive voltage of several hundred volt on Si, is well known as Mallory sealing process and has been in use. However, anodic bonding of glass and metal has not been comprehensively investigated and mechanism of the bonding has not been well understood.A fundamental study on anodic bonding of borosilicate glass and metal was carried out. Glass to Mo bonding and glass to Al bonding were successfully made, and glass to 304ss, glass to Ti, glass to Ni and glass to Au bondings were also made but they fractured at low stress level. Bonding test of glass and Mo using the design of experiment was carried out in order to specify dominant bonding parameters. Then, it has become clear that the bonding temperature and the applying voltage should be dominant in the range of bonding temperature of 400°C-600°C, applying voltage of 0 V-350 V, bonding time of 5 min-60 min, bonding pressure of 0.03 MPa-0.7 MPa in Ar atmosphere or in vacuum. Microscopic observations and chemical analysis were performed for glass to Mo bonded structure. The reaction zone between glass and Mo was not identified from the results of SEM and EPMA. Result of ESCA analysis revealed that Na, which was not found around the boundary, was detected in glass near the anode and Mo oxide was detected in glass near the boundary. Basing on the results, it has been considered that metal ions would diffuse into glass substituting for Na' and metal oxide be formed, then glass to metal bonding should be achieved.

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玻璃金属阳极键合的研究。

玻璃与硅的阳极键合，是通过在硅上施加几百伏的正电压来实现的，被称为马洛里密封工艺，并已得到应用。然而，玻璃与金属的阳极键合还没有得到全面的研究，其键合机理也没有得到很好的了解。对硼硅玻璃与金属的阳极键合进行了基础研究。成功地实现了玻璃- Mo键合和玻璃- Al键合，也成功地实现了玻璃- 304ss键合、玻璃- Ti键合、玻璃- Ni键合和玻璃- Au键合，但它们在低应力水平下断裂。采用实验设计法进行了玻璃与钼的粘结试验，确定了主要的粘结参数。在氩气或真空条件下，焊温为400℃~ 600℃，焊电压为0 V ~ 350 V，焊时间为5 min ~ 60 min，焊压为0.03 MPa ~ 0.7 MPa。对玻璃-钼键合结构进行了显微观察和化学分析。SEM和EPMA均未发现玻璃与Mo之间的反应区。ESCA分析结果表明，在阳极附近的玻璃中检测到边界附近没有发现的Na，在边界附近的玻璃中检测到Mo氧化物。在此基础上，认为金属离子会扩散到玻璃中取代Na'，形成金属氧化物，然后实现玻璃与金属的键合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Transactions of the Japan Welding Society

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