Wireless monitoring of collagen progression around implantable prostheses

Ahmad Hassan, Aref Trigui, M. Sawan
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引用次数: 1

Abstract

Bıocompatıbılıty remains a critical issue due to the foreign body response following device implantation. “Collagen” is the main bio-material composed around the implanted devices. This paper reports the possibility to measure the thickness of the “Collagen layers” using impedance measurement. An implanted passive circuit sensitive to the collagen thickness is wirelessly connected to the external reading circuit through inductive coupling. The resonance frequency of the system is directly proportional to the Collagen layer thickness variation. A modeling and simulation study of the Collagen material is presented by “COMSOL” to verify the functionality and obtain the optimal design parameters. Reported results demonstrate the increment of collagen capacitance from 30fF to 120fF when the collagen thickness rises from 1mm to 6mm. The experimental validation is reported using Impedance Analyzer. The measured resonance frequency drops from 55.78MHz to 54.98MHz when the collagen thickness increases from 0 to 10mm.
植入式假体周围胶原蛋白进展的无线监测
Bıocompatıbılıty仍然是一个关键问题,由于异物反应后植入装置。“胶原蛋白”是植入装置周围的主要生物材料。本文报道了用阻抗测量“胶原层”厚度的可能性。植入的对胶原蛋白厚度敏感的无源电路通过电感耦合与外部读取电路无线连接。系统的共振频率与胶原蛋白层厚的变化成正比。利用COMSOL软件对胶原蛋白材料进行了建模和仿真研究,验证了胶原蛋白材料的功能并获得了最佳设计参数。有报道的结果表明,当胶原蛋白厚度从1mm增加到6mm时,胶原电容从30fF增加到120fF。用阻抗分析仪进行了实验验证。当胶原蛋白厚度从0增加到10mm时,测量到的共振频率从55.78MHz下降到54.98MHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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