Mechanically alloyed Mg2Si/sub 1-x/Snx solid solutions as thermoelectric materials

M. Riffel, J. Schilz
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引用次数: 11

Abstract

Mg/sub 2/Si/sub 1-x/Sn/sub x/ solid solutions with (0/spl les/x/spl les/0.4) were prepared by mechanical alloying and subsequent hot-pressing. It was found that the alloying process during milling develops in one of two different directions. The first one leads to the nominal composition with only a small amount of iron impurities resulting from wear of the milling media. In the second route-which only occurs in the presence of Sn-an abrasive phase is formed and the Fe content may increase up to 50 at%. The Fe is bound in FeSi and consequently, the solid solution has a lack of Si. The hot-pressing was performed at a temperature smaller than the peritectic temperature of the quasibinary Mg/sub 2/Si-Mg/sub 2/Sn system. A decomposition of the solid solutions occurs, which suggest changes on the miscibility gap in published phase diagrams. However, some transport measurements on the multiphase materials were performed, which revealed lower mobility values and lattice thermal conductivities compared to values published in the literature for single crystalline materials. The mobility of our materials was found to be independent from composition whereas the thermal conductivity decreases with increasing Sn content.
机械合金化Mg2Si/sub - 1-x/Snx固溶体作为热电材料
采用机械合金化和热压法制备了(0/spl les/x/spl les/0.4) Mg/sub 2/Si/sub 1-x/Sn/sub x/固溶体。发现铣削过程中合金化过程向两个不同方向之一发展。第一种方法导致标称组合物中只有少量的铁杂质,这些铁杂质是由铣削介质的磨损引起的。在第二种方法中,只发生在sn存在的情况下,形成磨料相,铁含量可以增加到50%。铁被束缚在FeSi中,因此,固溶体缺乏Si。热压温度小于准二元Mg/sub - 2/Si-Mg/sub - 2/Sn体系的包晶温度。固溶体发生分解,这表明在已发表的相图中混相间隙发生了变化。然而,对多相材料进行了一些输运测量,结果表明,与文献中发表的单晶材料相比,多相材料的迁移率值和晶格导热系数更低。我们发现材料的迁移率与成分无关,而热导率随着Sn含量的增加而降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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