Flip-chip for millimeter-wave and broadband packaging

Abstract

Emerging markets for mm-wave wireless and sensor systems as well as high bit-rate components demand for cost-effective packaging solutions. Flip-chip is one of the most promising approaches in this regard combining high-volume potential with excellent high-frequency performance. The talk presents the different flip-chip concepts in use, focusing on the microwave characteristics and approaching the subject from the designer's point of view. Basic electromagnetic properties of the interconnects as well as consequences for chip and package design are discussed. As carrier substrates, conventional ceramics, thin-film, and LTCC-multilayer approaches are covered. Experimental results for various applications document feasibility and capabilities in the frequency range up to 100 GHz.