Resin composites top/bottom hardness and different light cure

T. Yoshikawa, A. Sadr
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Abstract

Purpose: The aim of this study was to evaluate microhardness and hardness ratio of two type hybrid resin composites using different irradiance light sources. Materials and Methods: Light curing units were an LED light-curing unit and an experimental quartz-tungsten-halogen (QTH) light-curing unit. The light-cured resin composites were Clearfil AP-X (shade A3) and Estelite ∑Quick (shade A3). Composite specimens of 2-mm thickness were polymerized in Teflon molds using an energy density of 24,000 mJ/cm 2 . Light curing methods were LED 1,200 mW/cm 2 for 20 s and QTH 600 mW/cm 2 for 40 s. Just after light curing, the Knoop hardness was measured at the top and bottom surfaces of each specimen. The hardness ratio was calculated as follows: Knoop hardness of bottom surface/Knoop hardness of top surface. Results: Immediately after light curing, the Knoop hardness at the bottom surfaces of resin composites was significantly lower than that at the top surfaces with 1,200 mW/cm 2 20 s for both resin composite ( p < 0.05). There is no significant difference between the Knoop hardness at the top surfaces and the bottom surfaces with 600 mW/cm 2 40 s for both resin composite ( p > 0.05). The 600 mW/cm 2 40 s showed significantly greater hardness ratio compared with that of the 1,200 mW/cm 2 20 s for both resin composite ( p < 0.05). Conclusion: The polymerization of resin composites at the bottom surface was inhibited compared with that of at the top surface using the regular irradiance of LED light.
树脂复合材料顶/底硬度及不同光固化
目的:研究不同辐照度光源下两种杂化树脂复合材料的显微硬度和硬度比。材料与方法:光固化单元为LED光固化单元和实验石英-钨-卤素(QTH)光固化单元。光固化树脂复合材料为Clearfil AP-X(阴影A3)和Estelite∑Quick(阴影A3)。采用24000 mJ/ cm2的能量密度在聚四氟乙烯模具中聚合厚度为2mm的复合试样。光固化方法分别为LED 1200 mW/ cm2 20 s和QTH 600 mW/ cm2 40 s。光固化后,在每个试样的上下表面测量努氏硬度。硬度比计算公式如下:底面Knoop硬度/顶面Knoop硬度。结果:光固化后,两种树脂复合材料在1200 mW/ cm2 20 s下,其底表面的Knoop硬度均显著低于上表面(p < 0.05)。两种树脂复合材料在600 mW/cm 240s时,其上表面和下表面的Knoop硬度无显著差异(p < 0.05)。两种树脂复合材料的硬度比均为600 mW/cm 2 40 s,显著高于1200 mW/cm 2 20 s (p < 0.05)。结论:相对于树脂复合材料的上表面聚合,LED光的常规照射抑制了树脂复合材料的下表面聚合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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