High performance cost effective inverter design — 1200V SPT+ IGBT chip in combination with CAL4 diode and 17mm IGBT module platform

D. Seng, A. Wahi
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Abstract

SEMIKRON is introducing the 2nd generation of the Soft-Punch-Through (SPT) Isolated Gate Bipolar Transistor (IGBT), the so called SPT+, in its flat 17 mm SEMiXtrade power module packages. For an optimised performance, the CAL 4 (Controlled Axial Lifetime) diode from SEMIKRON, especially designed for the fourth IGBT generation, will be used. This combination of new technologies in the latest power module package shows lower switching and conduction losses in comparison to the former chip generations. These improvements allow cost effective inverter designs together with improved softness from the chip side.
高性价比的逆变器设计- 1200V SPT+ IGBT芯片结合CAL4二极管和17mm IGBT模块平台
赛米控(SEMIKRON)在其扁平17毫米SEMiXtrade电源模块封装中推出了第二代软穿孔(SPT)隔离栅双极晶体管(IGBT),即所谓的SPT+。为了优化性能,将使用赛米控专门为第四代IGBT设计的cal4(受控轴向寿命)二极管。与前几代芯片相比,最新功率模块封装中的新技术组合显示出更低的开关和传导损耗。这些改进使得具有成本效益的逆变器设计以及从芯片方面改进的柔软性成为可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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