Fully functional perpendicular STT-MRAM macro embedded in 40 nm logic for energy-efficient IOT applications

Yu Lu, T. Zhong, W. Hsu, S. Kim, X. Lu, J. Kan, C. Park, W. C. Chen, X. Li, X. Zhu, P. Wang, M. Gottwald, J. Fatehi, L. Seward, J. P. Kim, N. Yu, G. Jan, J. Haq, S. Le, Y. Wang, L. Thomas, J. Zhu, H. Liu, Y. Lee, R. Tong, K. Pi, D. Shen, R. He, Z. Teng, V. Lam, R. Annapragada, T. Torng, P. Wang, S. H. Kang
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引用次数: 56

Abstract

We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.
功能齐全的垂直STT-MRAM宏嵌入40纳米逻辑,用于节能物联网应用
我们首次提出了一个功能齐全的40纳米垂直STT-MRAM宏(1 Mb, ×32/×64 IO)嵌入到代工标准CMOS逻辑平台中。我们在标准核心和IO电压下实现了20 ns读取访问时间和20-100 ns写入周期时间的目标设计规范,而无需冗余修复。在写入脉冲短至6 ns的情况下,可以可靠地切换满1mb宏,从而使×64的全芯片写入功率达到~ 3.2 μW/Mbps。这是在全芯片水平上报道的最低eNVM写功率,比eFLASH小三个数量级。0.5 Mbit高密度位元阵列也表现出良好的Rp分布和100% STT切换。我们的研究结果表明,垂直STT-MRAM具有卓越的功率面积特征属性,是40纳米物联网(IOT)应用中同类最佳的统一eNVM解决方案,并将这些优势扩展到28纳米及以上。
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