Yu Lu, T. Zhong, W. Hsu, S. Kim, X. Lu, J. Kan, C. Park, W. C. Chen, X. Li, X. Zhu, P. Wang, M. Gottwald, J. Fatehi, L. Seward, J. P. Kim, N. Yu, G. Jan, J. Haq, S. Le, Y. Wang, L. Thomas, J. Zhu, H. Liu, Y. Lee, R. Tong, K. Pi, D. Shen, R. He, Z. Teng, V. Lam, R. Annapragada, T. Torng, P. Wang, S. H. Kang
{"title":"Fully functional perpendicular STT-MRAM macro embedded in 40 nm logic for energy-efficient IOT applications","authors":"Yu Lu, T. Zhong, W. Hsu, S. Kim, X. Lu, J. Kan, C. Park, W. C. Chen, X. Li, X. Zhu, P. Wang, M. Gottwald, J. Fatehi, L. Seward, J. P. Kim, N. Yu, G. Jan, J. Haq, S. Le, Y. Wang, L. Thomas, J. Zhu, H. Liu, Y. Lee, R. Tong, K. Pi, D. Shen, R. He, Z. Teng, V. Lam, R. Annapragada, T. Torng, P. Wang, S. H. Kang","doi":"10.1109/IEDM.2015.7409770","DOIUrl":null,"url":null,"abstract":"We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"56","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409770","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 56
Abstract
We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.