Migration from an AlGaAs to an InGaP emitter HBT IC process for improved reliability

T. Low, C. Hutchinson, P. Canfield, T. Shirley, R. Yeats, J.S.C. Chang, G. Essilfie, M. Culver, W.C. Whiteley, D. D'Avanzo, N. Pan, J. Elliot, C. Lutz
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引用次数: 54

Abstract

A reliable high performance InGaP emitter HBT process has been developed for RF and microwave instruments. The InGaP process achieves Ft and Fmax values of 65 GHz and 75 GHz, respectively, with BVeeo=8.4 V and beta=132. The MTTF values of >5/spl times/10/sup 5/ hours at maximum operating conditions (Tj=150/spl deg/C, Jc=0.6 mA/um/sup 2/) are an order of magnitude larger than values measured on both internal and commercially available AlGaAs emitter HBT circuits. The dominant failure mode was beta drift, consistent with other published reports for other InGaP HBTs, but the Ea of 0.68 eV is much smaller than published values, which suggests that an additional high activation energy mechanism was introduced at the high temperatures used in the published reliability tests.
从AlGaAs迁移到InGaP发射极HBT IC工艺,以提高可靠性
为射频和微波仪器开发了一种可靠的高性能InGaP发射极HBT工艺。InGaP工艺的Ft和Fmax分别达到65 GHz和75 GHz, BVeeo=8.4 V, beta=132。在最大工作条件下(Tj=150/spl°/C, Jc=0.6 mA/um/sup 2/) >5/spl times/10/sup 5/小时的MTTF值比在内部和市售的AlGaAs发射极HBT电路上测量的值大一个数量级。主要失效模式为β漂移,与其他已发表的报告一致,但0.68 eV的Ea远小于已发表的值,这表明在已发表的可靠性测试中使用的高温下引入了额外的高活化能机制。
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