Super-small and low-power front-end HIC using MBB technology for 1.9 GHz bands

Abstract

Super-small and low-power receiver front-end hybrid IC(HIC) using Micro Bump Bonding (MBB) technology for 1.9 GHz bands has been newly developed. By using the MBB, the HIC was miniaturized to 3.5/spl times/4.0/spl times/1.0 mm, which is more than 60% of reduction as compared with the conventional one. Conversion gain of 16.0 dB, IP3 out of 0 dBm, image rejection ratio over 20 dBc were obtained for the HIC at 1.9 GHz, 3.0 V and 4.5 mA of power supply.