Analytical modelling of SiC MOSFET based on datasheet parameters considering the dynamic transfer characteristics and channel resistance dependency on the drain voltage
{"title":"Analytical modelling of SiC MOSFET based on datasheet parameters considering the dynamic transfer characteristics and channel resistance dependency on the drain voltage","authors":"Hemanth Varun Betha, M. Odavic, K. Atallah","doi":"10.1109/APEC43580.2023.10131160","DOIUrl":null,"url":null,"abstract":"Silicon Carbide devices enable high power density power electronic converters due to their lower junction capacitances and higher thermal conductivity. Analytical models of these devices help in estimating the switching dynamics, losses and current/voltage stresses on the devices. The dynamics of SiC MOSFET current during turn ON is impacted by the drain voltage it is switched at, due to the drain induced barrier lowering (DIBL) effect. This is however ignored in the existing analytical models available in the literature. This paper thus proposes and develops a new analytical modelling approach that models this effect by relying only on the datasheet parameters, thereby avoiding the need for expensive and time-consuming experimental methods. Dynamic channel resistance is also modelled as a function of drain voltage. The analysis reveals the impact of drain voltage on damping time of high frequency drain current oscillations during turn ON. An experimental double pulse test (DPT) setup using 1.2kV SiC MOSFET (C3MOOI0602K) and Schottky diode (C4D40120D) is built to verify the findings. Further, the accuracy of the proposed model is compared against the most detailed existing model in the literature.","PeriodicalId":151216,"journal":{"name":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43580.2023.10131160","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Silicon Carbide devices enable high power density power electronic converters due to their lower junction capacitances and higher thermal conductivity. Analytical models of these devices help in estimating the switching dynamics, losses and current/voltage stresses on the devices. The dynamics of SiC MOSFET current during turn ON is impacted by the drain voltage it is switched at, due to the drain induced barrier lowering (DIBL) effect. This is however ignored in the existing analytical models available in the literature. This paper thus proposes and develops a new analytical modelling approach that models this effect by relying only on the datasheet parameters, thereby avoiding the need for expensive and time-consuming experimental methods. Dynamic channel resistance is also modelled as a function of drain voltage. The analysis reveals the impact of drain voltage on damping time of high frequency drain current oscillations during turn ON. An experimental double pulse test (DPT) setup using 1.2kV SiC MOSFET (C3MOOI0602K) and Schottky diode (C4D40120D) is built to verify the findings. Further, the accuracy of the proposed model is compared against the most detailed existing model in the literature.
碳化硅器件由于其较低的结电容和较高的导热性,使高功率密度的电力电子变换器成为可能。这些器件的分析模型有助于估计器件上的开关动力学、损耗和电流/电压应力。由于漏极诱导势垒降低(DIBL)效应,SiC MOSFET在导通过程中的电流动态受到开关处漏极电压的影响。然而,在文献中现有的分析模型中忽略了这一点。因此,本文提出并开发了一种新的分析建模方法,该方法仅依靠数据表参数来模拟这种效应,从而避免了昂贵且耗时的实验方法。动态通道电阻也被建模为漏极电压的函数。分析了漏极电压对高频漏极电流在导通过程中振荡衰减时间的影响。利用1.2kV SiC MOSFET (C3MOOI0602K)和肖特基二极管(C4D40120D)建立了实验双脉冲测试(DPT)装置来验证研究结果。此外,将所提出模型的准确性与文献中最详细的现有模型进行了比较。