Development of Advanced Liquid Cooling Solution on Data Centre Cooling

Abstract

In this paper, we present design and development of advanced liquid cooling solution enabling high energy efficiency and low cooling cost. This is a multi-scale thermal solution including chip level, server level and cabinet level. At chip level, cooling modules with Si-based jet impingement micro-coolers have been developed for the main heat source cooling, such as server processors. In other words, the cooling modules are mounted on the top of server processors for direct liquid cooling. At server level, multiple mini cooling modules have been developed for main heaters in each server. Multiple mini heat exchangers of compact size and high heat transfer rate have been implemented on the board. Micro-scale heat transfer enhancement structures have been designed for liquid-to-liquid mini heat exchanger. In this cooling system, the need for air conditioner cooling is eliminated for energy saving. Smart energy management has been performed in the cabinet to control multiple cooling modules and mini heat exchangers, based on the real time temperature monitor. The energy consumption required for cooling system is further reduced, while maintaining appropriate heat removal capability for the servers.