RF power characteristics of SiGe heterojunction bipolar transistor with high breakdown voltage structures

T. Matsuno, K. Nishii, S. Sonetaka, Y. Toyoda, N. Iwamoto
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引用次数: 3

Abstract

The collector profile dependences of RF power characteristics of SiGe HBT have been studied. A selectively ion implanted collector (SIC) structure with a thick and lightly doped collector layer showed good RF power characteristics including the adjacent-channel-power-ratio characteristics for middle class power around output power of 16 dBm while maintaining BV/sub CEO/ over 5 V. The maximum BVCEO of 9 V was obtained using the same process only by removing the SIC structure. Both structures are available to fabrication of multi-stage RF power amplifier on to one chip by single process.
高击穿电压结构SiGe异质结双极晶体管的射频功率特性
研究了SiGe HBT射频功率特性与集电极外形的关系。具有厚且轻掺杂集电极层的选择性离子注入集电极(SIC)结构具有良好的射频功率特性,包括在输出功率为16 dBm左右时中等功率的邻接通道功率比特性,同时保持BV/sub CEO/大于5 V。采用相同的工艺,仅去除SIC结构即可获得9 V的最大BVCEO。这两种结构都适用于单工艺在单芯片上制造多级射频功率放大器。
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