P-vinyl phenol polymer — A highly heat resistant new material for insulation

1977 EIC 13th Electrical/Electronics Insulation Conference Pub Date : 1977-09-01 DOI:10.1109/EIC.1977.7461958

Asao Takahashi, M. Shimizu, Tetsuichiro Horio

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Abstract

Maruzen Resin M (poly p-vinyl phenol) and Maruzen Resin MB (brominated poly p-vinyl phenol) are new materials developed recently. They are easily cured with epoxy resins without generating volatiles, and yield crosslinked products possessing superior performances for insulation. Epoxy-cured Resin M is suitable for FRP, especially for high grade printed circuit board because of its excellent thermal stabilities (solder resistance, flexural strength, peel strength and electric prperties under high temperature), drilling performances and chemical resistances. The thermal properties are comparable to those of polyimide, and processing conditions are similar to conventional heat-stable epoxy resins. Flame retardant type composite can be obtained by using Resin MB, with little affection to the improved properties above-mentioned. Epoxy-cured Resins M and MB also give electric insulators and structural materials keeping superior thermal and electric performances by molding or casting. Furthermore, the resins are expected to be useful for widespread applications such as adhesives, coatings etc., where high heat-resistance is required.

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对乙烯基苯酚聚合物——一种高耐热的新型绝缘材料

Maruzen Resin M(聚对乙烯基苯酚)和Maruzen Resin MB(溴化聚对乙烯基苯酚)是近年来开发的新材料。它们很容易与环氧树脂固化而不产生挥发物，并且产生具有优异绝缘性能的交联产品。环氧固化树脂M因其优异的热稳定性(耐焊性、抗折强度、剥离强度和高温下的电性能)、钻削性能和耐化学性，适用于FRP，尤其适用于高档印刷电路板。热性能与聚酰亚胺相当，加工条件与传统的热稳定环氧树脂相似。用MB树脂可得到阻燃型复合材料，对上述性能的改善影响不大。环氧固化树脂M和MB还通过成型或铸造使电绝缘体和结构材料保持优异的热电性能。此外，该树脂有望广泛应用于粘合剂、涂料等需要高耐热性的领域。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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1977 EIC 13th Electrical/Electronics Insulation Conference

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