Studying of fracture joint failure mechanism on board level reliability test process comparing between SnPb and Sn lead finished ICs

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222748

N. Kongtongnok, S. Anuntapong

引用次数: 0

Abstract

In this paper, the results of the fracture joint failure mechanism and pattern when perform board level reliability test by comparing between SnPb and Pb-free lead finished ICs. It is modelling simulation by using finite element method analysis.

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在板级可靠性试验过程中比较SnPb和Sn铅成品集成电路的断裂接头失效机理研究

本文通过对含SnPb和无pb成品集成电路进行板级可靠性试验，分析了其断裂接头失效机理和模式。采用有限元法进行建模仿真分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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