Characterization of tunnel oxides for non-volatile memory (NVM) applications

J. Ackaert, T. Vermeulen, A. Lowe, S. Boonen, T. Yao, J. Prasad, M. Thomason, J. van Houdt, R. Degraeve, L. Haspeslagh, P. Hendrickx
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Abstract

The purpose of this paper is to characterize, to compare different types of tunnel oxides and to determine the impact on the MB (Moving Bit measurement) issues. The measurements and comparison carried out for the following tunnel oxide thickness in the range of 8 to 10 nm is used. They are: (1) Dry oxidation at 900 C which gives acceptable oxide quality in the thickness range of 100 /spl Aring/ (2) 5% O/sub 2/ diluted oxidation at 900 C, (3) 5% O/sub 2/ diluted oxidation at 960 C and (4) Wet oxidation at 750 C which gives superior results even for a minimal oxide thickness of 88.9 /spl Aring/.
用于非易失性存储器(NVM)应用的隧道氧化物的表征
本文的目的是表征,比较不同类型的隧道氧化物,并确定对MB(移动钻头测量)问题的影响。下面的隧道氧化物厚度在8到10纳米的范围内进行了测量和比较。它们是:(1)900℃下的干氧化,在100 /spl Aring/厚度范围内提供可接受的氧化物质量;(2)900℃下的5% O/ sub2 /稀释氧化;(3)960℃下的5% O/ sub2 /稀释氧化;(4)750℃下的湿氧化,即使最小的氧化物厚度为88.9 /spl Aring/,也能提供优异的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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