Novel way of microreliefs fabrication for MEMS

Abstract

The main goal of this work is low-cost technologies for precision microrelief production developed using common microelectronics materials and equipment. Three technologies of microrelief formation were worked out: polyimide, porous silicon, and porous alumina. Microreliefs were fabricated using nanocomposite materials instead of homogeneous metals, i.e. co-deposited metal matrix with inert ultra-fine particles by electroless or plating processes. Microreliefstructures were produced and tested in view of application for display and optical systems.