Xiaojing Fan, Yong Zhao, Yabin Li, Na Wang, Hongying Zhang
{"title":"Thermal Design and Welding Process of a Radar Double-sided Module","authors":"Xiaojing Fan, Yong Zhao, Yabin Li, Na Wang, Hongying Zhang","doi":"10.1109/CISS57580.2022.9971174","DOIUrl":null,"url":null,"abstract":"In order to ensure the safety and stability of the operation of a radar double-sided module and prevent the high-power devices in the module from overheating during operation, a thermal design scheme is proposed for the design of structural parts, the distribution of high-power devices and the cooling structure. The technical difficulties of microwave dielectric substrate welding of double-sided modules are analyzed, and the integrated welding process is adopted to realize the welding of double-sided modules dielectric boards, which improves the soldering area ratio of the dielectric boards and reduces the thermal resistance of the components. The temperature field simulation and analysis are carried out through ANSYS Workbench thermal simulation software, which verifies the rationality of thermal design. The result, the reliability of the assembly is ensured by thermal design and the design of the microwave dielectric substrate welding process.","PeriodicalId":331510,"journal":{"name":"2022 3rd China International SAR Symposium (CISS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 3rd China International SAR Symposium (CISS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CISS57580.2022.9971174","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In order to ensure the safety and stability of the operation of a radar double-sided module and prevent the high-power devices in the module from overheating during operation, a thermal design scheme is proposed for the design of structural parts, the distribution of high-power devices and the cooling structure. The technical difficulties of microwave dielectric substrate welding of double-sided modules are analyzed, and the integrated welding process is adopted to realize the welding of double-sided modules dielectric boards, which improves the soldering area ratio of the dielectric boards and reduces the thermal resistance of the components. The temperature field simulation and analysis are carried out through ANSYS Workbench thermal simulation software, which verifies the rationality of thermal design. The result, the reliability of the assembly is ensured by thermal design and the design of the microwave dielectric substrate welding process.