Influence of Grain Refinement on Direct Bonding for Electrodeposited Copper

Abstract

This study aims to investigate microstructural effect on direct Cu bonding. Electro-deposited Cu samples with different grain sizes, preferred orientations as well as hardnesses were prepared. The influence of individual factors will be studied especially grain size. Experimental results show that through grain refinement the strength of directly-bonded electroplated copper joints can be effectively increased by 30%.