Dual-Band Structurally Embedded High-Temperature Resistant Antenna with High Isolation and Wide Beam

2023 IEEE MTT-S International Wireless Symposium (IWS) Pub Date : 2023-05-14 DOI:10.1109/IWS58240.2023.10222076

Jiayi Tao, Zhi-tao Yang, Liang Ren, Jianyan Liu, H.-W. Deng

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Abstract

In this paper, a dual-band structurally embedded high-temperature resistant antenna operating at X-band and Ka-band is designed with high isolation and wide beam. The dual-band antenna is composed of a ceramic dielectric double-sided printed dipole antenna (DSPDA) connected with substrate integrated waveguide (SIW) and a ceramic dielectric rod antenna (DRA) fed by the dielectric-filled waveguide, whose broadside is replaced by the SIW. High isolation performance can be realized due to polarization orthogonality between DSPDA and DRA. The dual-band antenna is embedded in the center position of the thermal insulation material, which is packaged by the thermal protection shield. Because of the lower thermal conductivity of the ceramic dielectric of DRA and the longer gap between DSPDA and the top of the thermal protection shield, the high-temperature resistant antenna can achieve good thermal insulation performance. Under the continuous time of the 1900s and surface heat source temperature of 1200°C, the feed ports can be kept within 165°C

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双频高隔离宽波束结构嵌入式耐高温天线

本文设计了一种工作在x波段和ka波段的高隔离宽波束双频结构嵌入式耐高温天线。该双频天线由与衬底集成波导(SIW)连接的陶瓷介质双面印刷偶极子天线(DSPDA)和由介质填充波导馈电的陶瓷介质棒天线(DRA)组成，其宽幅由SIW代替。由于DSPDA和DRA之间的偏振正交性，可以实现较高的隔离性能。双频天线埋设在保温材料的中心位置，保温材料由热防护罩封装。由于DRA的陶瓷介质导热系数较低，DSPDA与热防护屏蔽顶部之间的间隙较长，因此耐高温天线可以获得良好的隔热性能。在1900年代的连续时间和1200℃的表面热源温度下，进料口温度可保持在165℃以内

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2023 IEEE MTT-S International Wireless Symposium (IWS)

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