T. Ohguro, Hideharu Kojima, T. Hara, T. Nishiwaki, Kenya Kobayashi
{"title":"Measuring of parasitic resistance of stacked chip of Si power device","authors":"T. Ohguro, Hideharu Kojima, T. Hara, T. Nishiwaki, Kenya Kobayashi","doi":"10.1109/ICMTS55420.2023.10094137","DOIUrl":null,"url":null,"abstract":"Stacked chip of! Si power device is useful for both lower on-resistance and small packaged size for reduction of system size and high power efficiency. In this paper, some structures and procedure to measure parasitic resistance of the stacked chip are described.","PeriodicalId":275144,"journal":{"name":"2023 35th International Conference on Microelectronic Test Structure (ICMTS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 35th International Conference on Microelectronic Test Structure (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS55420.2023.10094137","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Stacked chip of! Si power device is useful for both lower on-resistance and small packaged size for reduction of system size and high power efficiency. In this paper, some structures and procedure to measure parasitic resistance of the stacked chip are described.