Development of Low-Temperature Process for Printed Electronics

Abstract

In order to fabricate an electric device that is printed on a plastic substrate successfully, it is important to decrease the process temperature as much as possible. Furthermore, low-cost processes and materials need to be developed so that they have a wide variety of uses. With this in mind, we have developed a low-temperature preparation method for electric materials such as semiconductors, insulators, and electrodes. In this paper, we discuss novel techniques for preparing high-performance SiO 2 using vacuum ultraviolet light and commercial Ag ink with decreased resistivity using pressure treatment in order to fabricate electric devices on reasonably priced plastic substrates. In addition, we also introduce a method for reducing the costs of developing printed devices by using Cu ink.