Fatigue of soft-soldered contacts at surface-mounted devices

Abstract

An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<>