Pitfalls and Tradeoffs in Simultaneous, On-Chip FPGA Delay Measurement

Timothy Linscott, Benjamin Gojman, Raphael Rubin, A. DeHon
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引用次数: 4

Abstract

Recent work shows how to use on-chip structures to measure the fabricated delays of fine-grained resources on modern FPGAs. We show that simultaneous measurement of multiple, disjoint paths will result in different measured delays from isolated configurations that measure a single path. On the Cyclone III, we show differences as large as +/-33ps on 2ns-long paths, even if the simultaneously configured logic is not active. This is over 20x the measurement precision used on these devices and over 50% of the observed delay spread in prior work. We characterize the magnitude of the impact of simultaneous measurements and identify strategies and cases that can reduce the difference. Furthermore, we provide a potential explanation for our observations in terms of self-heating and the configurable clock network architecture. These experiments point to phenomena that must be characterized to better formulate on-chip FPGA delay measurements and to properly interpret their results.
片上FPGA同步延迟测量的陷阱与权衡
最近的工作展示了如何使用片上结构来测量现代fpga上细粒度资源的制造延迟。我们表明,同时测量多个不相交的路径将导致与测量单个路径的隔离配置不同的测量延迟。在Cyclone III上,即使同时配置的逻辑没有激活,我们也可以在2ns长的路径上显示出+/-33ps的差异。这是在这些设备上使用的测量精度的20倍以上,并且在先前工作中观察到的延迟扩展超过50%。我们描述了同时测量的影响程度,并确定了可以减少差异的策略和案例。此外,我们提供了一个潜在的解释,我们的观察方面的自加热和可配置的时钟网络架构。这些实验指出了必须表征的现象,以便更好地制定片上FPGA延迟测量并正确解释其结果。
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