{"title":"\"Lead-Free Soldering\", Its Direction and Soluition","authors":"K. Suganuma","doi":"10.2320/MATERIA.38.919","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":328460,"journal":{"name":"Bulletin of the Japan Institute of Metals","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bulletin of the Japan Institute of Metals","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2320/MATERIA.38.919","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}