GaN HEMTs on silicon for power devices

Abstract

In order to develop high voltage high current and high temperature HEMT transistors, we have studied an isolated gate based on a thin Al2O3. TCAD simulations have been used to explain abnormal C(V) results depending on the density and localization of positive charges under the gate. We have found and explained the dependence between degradation of Al2O3 interface and electrical characteristics.