Implementation of total dose constraints at the design level of full custom bipolar integrated circuits

Y. Deval, P. Fouillat, X. Montagner, R. Briand, A. Touboul, J. David, L. Bonora, M. Calvet, P. Calvel
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引用次数: 5

Abstract

This paper presents a design approach in order to deal with total-dose induced degradation with commercial IC processes. Devices behavior limitations are presented, and layout-based techniques are proposed to reduce bipolar transistors radiation sensitivity. The global design procedure combines these layout hardened devices with rad-dedicated design techniques. In addition, a gated lateral PNP has been designed to evaluate the ionizing radiation effects on its electrical characteristics. Its voltage controlled current gain remains sufficiently large once irradiated to expect an effective hardening of the analog function. To illustrate this approach, a commercial BiCMOS integrated circuit has been fabricated in an Austria Mikro Systeme process. The test vehicle revealed a good radiation hardness level.
在全定制双极集成电路的设计水平上实现总剂量限制
本文提出了一种处理商业集成电路工艺中总剂量诱导降解的设计方法。提出了器件行为的限制,并提出了基于布局的技术来降低双极晶体管的辐射灵敏度。全球设计程序将这些布局硬化设备与专用设计技术相结合。此外,还设计了一个门控横向PNP,以评估电离辐射对其电学特性的影响。它的电压控制电流增益保持足够大,一旦辐照,期望有效硬化模拟功能。为了说明这种方法,在奥地利Mikro系统工艺中制造了商用BiCMOS集成电路。试验车辆显示出良好的辐射硬度水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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