An In/sub 0.52/Al/sub 0.48/As/n/sup +/-In/sub x/Ga/sub 1-x/As heterostructure field-effect transistor with an In-enriched channel

S. Bahl, J. D. del Alamo
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引用次数: 7

Abstract

In/sub 0.52/Al/sub 0.48/As/n/sup +/-In/sub x/Ga/sub 1-x/As HFETs have been fabricated with InAs fractions between 0.53 and 0.7 in the channel. These HFETs, also called MIDFETs (metal-insulator doped-channel FETs), have a doped channel and an undoped wide-bandgap insulator. The enhancement of InAs in the channel results in a marked improvement in transconductance and peak drain current. Devices with L/sub g/=1 mu m and x=0.7 display an unprecedented I/sub d/ of 656 mA/mm and g/sub m/ of 296 mS/mm. As x is increased, however, there is an increase in the gate current, a dramatic decrease in the breakdown voltage, and a degradation of pinch-off. Leakage at the gate-mesa edge overlap is found to be partially responsible for these effects. To achieve the substantial gains in transport that higher InAs fractions offer, better isolation technology is required.<>
In/sub 0.52/Al/sub 0.48/As/n/sup +/ In/sub x/Ga/sub 1-x/As异质结构场效应晶体管富In沟道
In/sub 0.52/Al/sub 0.48/As/n/sup +/ In/sub x/Ga/sub 1-x/As在沟道中InAs分数在0.53 ~ 0.7之间。这些hfet,也称为midfet(金属绝缘体掺杂沟道fet),具有掺杂沟道和未掺杂的宽带隙绝缘体。沟道中InAs的增强导致跨导和峰值漏极电流的显著改善。L/sub g/=1 μ m和x=0.7的器件显示出前所未有的I/sub d/ 656 mA/mm和g/sub m/ 296 mS/mm。然而,随着x的增加,栅极电流增加,击穿电压急剧下降,并且销断退化。发现在门-台面边缘重叠处的泄漏是这些影响的部分原因。为了实现更高的InAs分数所提供的传输性能的实质性提高,需要更好的隔离技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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