ESD protection design for radio-frequency integrated circuits in nanoscale CMOS technology

Chun-Yu Lin, Li-Wei Chu, Shiang-Yu Tsai, M. Ker, Ming-Hsiang Song, C. Jou, T. Lu, J. Tseng, M. Tsai, T. Hsu, P. Hung, Y. Wei, T. Chang
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Abstract

Nanoscale CMOS technologies have been used to implement the radio-frequency integrated circuits. However, the thinner gate oxide in nanoscale CMOS technology seriously degrades the electrostatic discharge (ESD) robustness of IC products. Therefore, on-chip ESD protection designs must be added at all input/output pads in CMOS chip. To minimize the impacts from ESD protection on circuit performances, ESD protection at input/output pads must be carefully designed. In this work, a new proposed ESD protection design has been realized in a nanoscale CMOS process. Experimental results of the test circuits have been successfully verified, including RF performances, I-V characteristics, and ESD robustness.
基于纳米级CMOS技术的射频集成电路ESD防护设计
纳米级CMOS技术已被用于实现射频集成电路。然而,纳米级CMOS技术中较薄的栅极氧化物严重降低了集成电路产品的静电放电(ESD)稳健性。因此,必须在CMOS芯片的所有输入/输出垫片上添加片内ESD保护设计。为了尽量减少ESD保护对电路性能的影响,必须仔细设计输入/输出端的ESD保护。在这项工作中,提出了一种在纳米级CMOS工艺中实现的新的ESD保护设计。测试电路的实验结果得到了成功的验证,包括射频性能、I-V特性和ESD稳健性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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