Chun-Yu Lin, Li-Wei Chu, Shiang-Yu Tsai, M. Ker, Ming-Hsiang Song, C. Jou, T. Lu, J. Tseng, M. Tsai, T. Hsu, P. Hung, Y. Wei, T. Chang
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引用次数: 0
Abstract
Nanoscale CMOS technologies have been used to implement the radio-frequency integrated circuits. However, the thinner gate oxide in nanoscale CMOS technology seriously degrades the electrostatic discharge (ESD) robustness of IC products. Therefore, on-chip ESD protection designs must be added at all input/output pads in CMOS chip. To minimize the impacts from ESD protection on circuit performances, ESD protection at input/output pads must be carefully designed. In this work, a new proposed ESD protection design has been realized in a nanoscale CMOS process. Experimental results of the test circuits have been successfully verified, including RF performances, I-V characteristics, and ESD robustness.