Experimental and theoretical investigation of the ‘apparent’ mobility degradation in Bulk and UTBB-FDSOI devices: A focus on the near-spacer-region resistance

D. Rideau, F. Monsieur, O. Nier, Y. Niquet, J. Lacord, V. Quenette, G. Mugny, G. Hiblot, G. Gouget, M. Quoirin, L. Silvestri, F. Nallet, C. Tavernier, H. Jaouen
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引用次数: 6

Abstract

This paper investigates the mobility `apparent' channel length dependency in nanometric devices. Based on a series of current and capacitance measurements, we report clear (VG)-1 dependencies of the access resistance in Bulk but also in FDSOI devices. We show that the μeff-Leff degradation observed at small L can be inferred from this gate-bias dependency. By means of numerical simulation, we show that in the near-spacer-region injection velocity saturation occurs and the spreading resistance exhibits a (VG)-1 dependency. A comparison between Bulk and FDSOI devices clearly shows that even in the absence of LDD-counter-doping (pocket), and channel doping, the near-spacer-region resistance is far to be negligible and can contribute up to ~30% of the total resistance (rTOT =VD/IDS) of a ~22nm device.
体积和UTBB-FDSOI器件中“明显”迁移率退化的实验和理论研究:关注近间隔区电阻
本文研究了纳米器件中迁移率“表观”通道长度的依赖性。基于一系列电流和电容测量,我们报告了Bulk器件中以及FDSOI器件中接入电阻的明确(VG)-1依赖性。我们证明了在小L处观察到的μeff-Leff退化可以从这种门偏倚依赖性推断出来。通过数值模拟,我们发现在近间隔区,注入速度出现饱和,扩散阻力呈(VG)-1关系。对Bulk和FDSOI器件的比较清楚地表明,即使在没有ldd反掺杂(口袋)和通道掺杂的情况下,近间隔区电阻也远不可忽略,可以贡献高达~22nm器件总电阻(rTOT =VD/IDS)的~30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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