{"title":"Design of a K-Band Integrated Tile-Type T/R Module","authors":"Junwei Shi, Guodong Song, Zhongyu Hu, Xiang Gao, Jing Tan, Lizheng Zhang","doi":"10.1109/CISS57580.2022.9971363","DOIUrl":null,"url":null,"abstract":"This paper proposed a three-dimensional K-band transmit/receive (T/R) module. The proposed module works in T/R time-sharing mode and each channel has the capability of independent amplitude and phase modulation. Due to the multi-functional chip technique the module is highly integrated and minified with 32 channels. The passive circuit and microwave monolithic integrated circuit chips are placed on middle and top layers of the multi-layer Rogers 6002 board respectively. The entire radio frequency circuit can be constructed by vertical interconnection structure. To obtain high transmission performance and low insertion loss the key passive components such as power divider are modeled and optimized using full-wave electromagnetic simulation software. Compared with traditional brick-type module the tile-type module has more prospects in active phased array radars due to its small size and light weight.","PeriodicalId":331510,"journal":{"name":"2022 3rd China International SAR Symposium (CISS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 3rd China International SAR Symposium (CISS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CISS57580.2022.9971363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper proposed a three-dimensional K-band transmit/receive (T/R) module. The proposed module works in T/R time-sharing mode and each channel has the capability of independent amplitude and phase modulation. Due to the multi-functional chip technique the module is highly integrated and minified with 32 channels. The passive circuit and microwave monolithic integrated circuit chips are placed on middle and top layers of the multi-layer Rogers 6002 board respectively. The entire radio frequency circuit can be constructed by vertical interconnection structure. To obtain high transmission performance and low insertion loss the key passive components such as power divider are modeled and optimized using full-wave electromagnetic simulation software. Compared with traditional brick-type module the tile-type module has more prospects in active phased array radars due to its small size and light weight.